Method for fabricating a field effect transistor, and field effect transistor

ABSTRACT

In a method for fabricating a field effect transistor, a first source/drain region and a second source/drain region are formed in a substrate. A channel region is formed between the first source/drain region and the second source/drain region. A gate region is formed on the channel region. Micro-cavities are formed in the substrate at least below the channel region, and the micro-cavities are oxidized.

BACKGROUND OF THE INVENTION

The invention relates to a method for fabricating a field effecttransistor and to a field effect transistor.

It is desirable to improve the performance of field effect transistors.

BRIEF DESCRIPTION OF THE FIGURES

Exemplary embodiments of the invention are illustrated in the figuresand are explained in more detail below. In the figures, identical orsimilar elements, insofar as is expedient, are provided with the same oridentical reference symbols. The illustrations shown in the figures aredepicted such that they are schematic and therefore not true to scale.

In the figures:

FIG. 1 shows a conventional field effect transistor with a buried oxidelayer;

FIG. 2A shows a process step of a method for fabricating a field effecttransistor in accordance with a first exemplary embodiment of theinvention;

FIG. 2B shows a process step of a method for fabricating a field effecttransistor in accordance with a second exemplary embodiment of theinvention;

FIG. 2C shows a further process step of the method for fabricating afield effect transistor in accordance with the first exemplaryembodiment of the invention;

FIG. 2D shows a first XTEM micrograph of micro-cavities;

FIG. 2E shows a further process step of the method for fabricating afield effect transistor in accordance with the first exemplaryembodiment of the invention;

FIG. 2F shows a second XTEM micrograph of micro-cavities;

FIG. 2G shows a further process step of the method for fabricating afield effect transistor in accordance with the first exemplaryembodiment of the invention;

FIG. 2H shows a first XTEM micrograph of oxidized micro-cavities;

FIG. 3 shows a length distribution of micro-platelets;

FIG. 4A shows a second XTEM micrograph of oxidized micro-cavities;

FIG. 4B shows a third XTEM micrograph of oxidized micro-cavities;

FIG. 5 and FIG. 6 show a field effect transistor in accordance with oneexemplary embodiment of the invention.

DETAILED DESCRIPTION OF THE INVENTION

So-called “stress engineering”, that is to say the deliberateutilization of stress effects in semiconductor components such as, forexample MOS field effect transistors (metal oxide semiconductor), is awidespread method for improving the performance of MOS field effecttransistors by increasing the charge carrier mobility in the conductivechannel.

While p-MOS field effect transistors require compressive stress forincreasing the hole mobility, tensile stress is required for increasingthe electron mobility in n-MOS field effect transistors.

Under suitable conditions it is possible to deposit nitride layers whichcan produce both tensile stress fields and compressive stress fields inthe channel of CMOS elements (Complementary Metal Oxide Semiconductor).One disadvantage of this method, however, is that only a fraction of theintrinsic nitride stress is transmitted into the channel on account ofthe large distance between the nitride layer and the channel.

Another method for producing stress fields is the so-called “EmbeddedEpitaxial Silicon/Germanium (eSi/Ge)” technique, which involves formingexpanding silicon/germanium in the source/drain regions very close tothe channel. One disadvantage of the eSi/Ge method, however, is that itcan only be used to produce compressive stress. Therefore, thistechnique can only be used for p-MOS field effect transistors.

As already mentioned, by contrast, tensile stress is required forimproving the performance of n-MOS field effect transistors. Onepossibility for producing additional stress in the channel of n-MOSfield effect transistors consists for example in forming buried oxidelayers with the aid of selective SIMOX techniques (separation byimplanted oxygen).

However, selective SIMOX has the following disadvantages:

(1) a selective SIMOX process is expensive since e.g. high oxygenimplantation doses of 10 ¹⁸ O₂ cm⁻² and high thermal budgets (e.g.tempering or annealing at 1300° C. for 6 h) are necessary.

(2) There is a high probability of the buried oxide layers insulatingthe channel region of the transistor from the bulk, which is shownschematically in FIG. 1.

FIG. 1 shows a conventional field effect transistor 100 comprising asubstrate 101, in which substrate 101 a source region 102, a drainregion 103 and also a channel region 104 are formed. A gate insulatinglayer 105 a (gate dielectric) is formed on the channel region 104, and aconductive gate layer 105 b (gate electrode) is formed on the gateinsulating layer 105 a. The gate insulating layer 105 a and theconductive gate layer 105 b are part of the transistor gate, which isencapsulated by electrically insulating spacers 106. A liner 107 (e.g.made of a nitride material) is additionally formed on the spacers 106,the source region 102, the drain region 103 and the conductive gatelayer 105 b. A buried oxide layer 108 is formed below the channel 104,said buried oxide layer being formed with the aid of a selective SIMOXmethod.

The illustration in FIG. 1 reveals that the continuous oxide layer 108electrically insulates the channel 104 from the bulk of the substrate101. Moreover, the source/drain space charge regions can extend into theoxide region 108, which is represented by the arrows. Floating bodyeffects and/or charging effects can occur as a consequence.

Embodiments of the invention which are described in connection with themethod for fabricating a field effect transistor apply analogously tothe field effect transistors as well, and vice versa.

In a method for fabricating a field effect transistor in accordance withone embodiment of the invention, a first source/drain region and asecond source/drain region are formed in a substrate. A channel regionis formed between the first source/drain region and the secondsource/drain region. A gate region is formed on the channel region.Micro-cavities are formed in the substrate at least below the channelregion. The micro-cavities are oxidized, for example in such a way thata region is formed in which an increased tensile stress is presentrelative to the undamaged crystal lattice of the substrate, and whichcomprises at least one-partial region of the channel region.

In accordance with another embodiment of the invention, a field effecttransistor is provided. The field effect transistor has a substrate, afirst source/drain region formed in the substrate, and a secondsource/drain region formed in the substrate. Furthermore, the fieldeffect transistor has a channel region formed between the firstsource/drain region and the second source/drain region. Furthermore, thefield effect transistor has a plurality of oxidized micro-cavitiesformed at least below the channel region in the substrate. The oxidizedmicro-cavities are formed for example in such a way that at least onepartial region of the channel region has an increased tensile stressrelative to the undamaged crystal lattice of the substrate.

In accordance with another embodiment of the invention, tensile stressor a tensile stress field is produced in a field effect transistor, moreprecisely in the channel region or at least one partial region of thechannel region of a field effect transistor. For this purpose, duringthe fabrication of the field effect transistor, in addition to theformation of the source/drain regions, the channel region and the gateregion (gate), micro-cavities are formed at least below the channelregion. Said micro-cavities serve as seeds for a subsequent internaloxidation, that is to say that the micro-cavities are oxidized. Theoxidized micro-cavities produce a tensile stress field extending atleast into a partial region of the channel region. In other words,tensile stress is produced on account of the oxidized micro-cavities inthe channel region (or in a partial region of the channel region),thereby increasing the charge carrier mobility in the channel and thusimproving the performance or functionality of the transistor.

In the context of this description, a micro-cavity is to be understoodto mean for example a cavity in the substrate with an extent in themicrometers range in all spatial directions, for example with an extentin the micrometers range in one or two spatial directions and with anextent in the nanometers range in one or two spatial directions or withan extent in the nanometers range in all spatial directions. It is thuspossible for a micro-cavity to have a width of for example 5 nm to 100nm or hundreds of nm, for example 10 nm to 100 nm or hundreds of nm, andalso a length of 20 nm to 100 nm or hundreds of nm and a height of 10 nmto 100 nm or hundreds of nm, for example approximately 50 nm.

In accordance with another embodiment of the invention, the substrate isformed as a silicon substrate, e.g. as a silicon wafer. By way ofexample, a (100) silicon substrate or a (111) silicon substrate may beused as the silicon substrate.

In accordance with another embodiment of the invention, the field effecttransistor is formed as an n-MOS field effect transistor with an n-dopedfirst source/drain region, an n-doped second source/drain region and ap-doped channel region. The standard techniques known in CMOStechnology, such as ion implantation for example, may be used fordoping. Boron may be used as a dopant for the p-type doping of thechannel, and arsenic and/or phosphorus may be used for the n-type dopingof the source/drain regions.

In accordance with another embodiment of the invention, the gate regionor the gate of the field effect transistor has a gate insulating layer(gate dielectric) (e.g. made of silicon dioxide) formed on the channelregion, and also a conductive gate layer or gate electrode (e.g. made ofpolysilicon or some other conductive material) formed on the gateinsulating layer or the gate dielectric.

In accordance with another embodiment of the invention, micro-plateletsare formed in the substrate and the micro-cavities are formed from themicro-platelets. To put it another way, the formation of themicro-cavities is effected with the aid of the formation ofmicro-platelets. In other words, micro-platelets, that is to saymicroscopic platelet-like defects in the crystal lattice structure ofthe substrate, are formed below the channel region, and micro-cavitiesare formed from the micro-platelets.

In accordance with another embodiment of the invention, light ions areimplanted into the substrate, so that the micro-cavities are formed inthe substrate.

In accordance with another embodiment of the invention, the light ionsare implanted into the substrate, so that the micro-platelets are formedin the substrate.

In other words, the formation of the micro-cavities and themicro-platelets, respectively, may be effected by the implantation oflight ions, that is to say ions having a low mass or having a small massnumber, to put it another way by light ion implantation.

The introduction of light ions into the substrate in order to form themicro-platelets or micro-cavities constitutes a very simple and reliablemechanism for fabricating the micro-cavities which is process-compatiblewith present-day CMOS processes (Complementary Metal OxideSemiconductor). Furthermore, ion implanters are among customaryapparatuses in the context of a semiconductor process, so that it is notnecessary to fundamentally alter the processes for fabricating the fieldeffect transistor or even to procure new apparatuses.

In accordance with another embodiment of the invention, H₂ ⁺ ions, He⁺ions, F⁺ ions, Ne⁺ ions, Cl⁺ ions or Ar⁺ ions may be implanted into thesubstrate as light ions.

The light ions implanted into the substrate clearly have the tendency tobreak covalent bonds in the substrate (e.g. covalent silicon bonds in asilicon substrate), whereby thin platelets are formed in oversaturatedregions. To put it another way, the implantation of light ions resultsin the production of platelet-like defects or lattice defects in thecrystal lattice of the substrate (e.g. in the crystal lattice of asilicon wafer). In this case, the micro-platelets are preferably formedin the vicinity of the maximum or peak of the light ion concentration inthe substrate. The depth R_(p) of the concentration maximum of theimplanted light ions is referred to as projected range R_(p), depthbeing understood as the distance from the substrate surface. It followsfrom the above that the concentration of the micro-platelets is alsomaximal in the vicinity of R_(p).

The micro-platelets may be elongated along a plane of symmetry of thesubstrate, depending on the orientation of a substrate surface. By wayof example, the platelets may be elongated along the (100) plane in thecase of a silicon substrate (silicon wafer) having a (100) surfaceorientation, and correspondingly along the (111) plane in the case of a(111) substrate (wafer), the length of the micro-platelets (that is tosay the extent parallel to the abovementioned plane of symmetry)following a distribution with a mean value and a standard deviationwhich may depend for example on the implantation dose Φ and/or on theimplantation energy E of the implanted light ions.

The dimensions of the micro-platelets may depend on the implantationconditions (e.g. implantation dose and/or implantation energy) and theconditions during an annealing step. In general, the length and thewidth of the micro-platelets may be of the order of magnitude ofapproximately 10 nm, and the height (that is to say the extentperpendicular to the abovementioned plane of symmetry) of themicro-platelets may be of the order of magnitude of approximately 0.54nm.

By means of the implantation dose Φ and/or the implantation energy E ofthe light ions, also the depth and the extent of the region in which themicro-platelets are formed can be influenced. In this context, depthonce again means the distance from the substrate surface, and extentmeans the extent in the direction of the normal to the surface, that isto say the extent along the [100] direction in the case of a (100)substrate.

In other words, in accordance with one embodiment of the invention, bymeans of varying the two parameters dose Φ and energy E (and possiblyother parameters), it is possible to influence the depth R_(p)(projected range) of the light ion concentration maximum andconsequently the position and/or the extent of the region in whichmicro-platelets are preferably formed.

By means of the depth and the extent of the micro-platelet region, it ispossible in turn to influence the depth of the region under stress, toput it another way the stressed region, in the substrate. In otherwords, R_(p) can be used to influence how deeply below the substratesurface the stressed region is formed. R_(p) in turn may be controllede.g. in a simple manner with the aid of the implantation energy E.

It must be taken into account in this connection that in the case of asmall depth of the stressed region, the latter possibly overlaps thesource/drain regions of the field effect transistor. Leakage currentsmay occur in the transistor in this case. On the other hand, in the caseof large depths, to put it another way in the case of the stressedregions situated very deeply, the magnitude of the stress in the channelregion decreases.

In accordance with another embodiment of the invention, the implantationenergy E may be optimized so as to obtain a compromise between the twoeffects mentioned above.

With the use of an approximately 10 nm thick screen oxide during an H₂ ⁺ion implantation, a depth or projected range R_(p) of approximately 100nm can be achieved for example with an implantation energy E=10 keV andan implantation dose Φ=10¹⁶ H₂/cm², and a depth or projected range R_(p)of approximately 850 nm can be achieved with an implantation energyE=150 keV and an implantation dose Φ=10¹⁶ H₂/cm².

Another embodiment of the invention provides for the light ions to havean implantation energy of between 10 keV and 150 keV.

In accordance with another embodiment of the invention, the light ionsare implanted with a dose of between 10¹⁵ cm⁻² and 4×10₁₇ cm⁻².

Yet another embodiment of the invention provides for an additional maskto be used during the implantation of the light ions. This mask servesto restrict the lateral extent of the stressed region to the area of thechannel region. Clearly, the use of a mask makes it possible to blockthe implantation of the light ions in predetermined regions of thesubstrate, so that no micro-platelets are formed in said predeterminedregions.

In accordance with another embodiment, a hard mask composed of an oxidematerial and a nitride material, for example, may be used as the mask.

In accordance with another embodiment of the invention, the opening ofthe mask may be optimized to the effect that maximum stresses or tensilestress values are obtained. The mask may have a size similar to thelength of the gate region (e.g. of the polysilicon gate).

In accordance with another embodiment of the invention, themicro-cavities may be formed by virtue of a thermal treatment or atempering of the substrate being effected after the formation of themicro-platelets. In other words, the substrate (e.g. the wafer) istempered or heated; to put it in yet another way, a so-called annealingstep is carried out.

In accordance with another embodiment of the invention, the tempering orthe process of heat treating, to put it another way the heating, of thesubstrate (or wafer) may be effected with a low thermal budget. By wayof example, the substrate may be heated to a temperature of between 600°C. and 800° C. during the thermal treatment, and the heating may beeffected for a duration of between 10 min and 2 h.

In accordance with another embodiment of the invention, the thermaltreatment with a low thermal budget may result in an outdiffusion of theimplanted light ions from the substrate in the form of neutral atoms ormolecules. That is to say that the heating results in the outdiffusionof H₂ molecules from the substrate in the case of implanted H₂ ⁺ ions,the outdiffusion of He atoms in the case of implanted He⁺ ions, theoutdiffusion of F atoms in the case of implanted F⁺ ions, etc.

The outdiffusion of the implanted light ions in the form of neutralatoms or molecules leads to the formation of a network or a band, to putit another way a strip-type region, of micro-cavities from themicro-platelets at the range or projected range R_(p).

In accordance with another embodiment of the invention, themicro-cavities in the band may have a length of 10 nm to 100 nm, a widthof 10 nm to 100 nm, and a height of 10 nm to 100 nm.

Both the size and the density of the micro-cavities formed depend on theprocess parameters of the method steps described above (light ionimplantation with dose Φ and energy E, thermal treatment withtemperature T and duration t). The process parameters can be chosen oroptimized such that the density and the size of the micro-cavities ineach case remain below predetermined threshold values, so that strippingor delamination of the silicon substrate does not occur. In other words,the density and/or the size of the micro-cavities are small enough suchthat the cohesion of the substrate is assured and layer splitting isthus avoided.

In accordance with another embodiment of the invention, the use of a lowthermal budget during the thermal treatment (low temperature anneal)additionally makes it possible to prevent the micro-cavities formed frombeing completely resolved.

Another embodiment of the invention provides for a second thermaltreatment to be effected after the thermal treatment, in such a way thata conservative ripening process of the micro-cavities is effected,during which a thinner band having larger micro-cavities is formed fromthe band of micro-cavities. In this context, conservative is understoodto mean that the total volume of micro-cavities is maintained during theripening process. The ripening process causes a large number ofrelatively small micro-cavities to form a smaller number of largermicro-cavities. This clearly takes place by two or more smallmicro-cavities “merging together” to form a larger micro-cavity. Thisprocess may also be referred to as a coarsening process.

Another embodiment of the invention provides for a thin band, e.g.having a thickness of approximately 20 nm to 100 nm, of micro-cavitiesto be formed in the course of the ripening process, in which case themicro-cavities may have a size of approximately 40 nm, and the densityof the micro-cavities may be approximately 10¹¹ cm⁻³.

In accordance with another embodiment of the invention, the secondthermal treatment is effected in such a way that the substrate is heatedto a temperature of between 1000° C. and 1300° C. The heating may beeffected for a duration of between 1 μs and 1 s.

In accordance with another embodiment of the invention, the oxidation ofthe micro-cavities is effected by means of a high-temperature treatmentand by means of the introduction of oxygen into the micro-cavities. Inother words, the high-temperature treatment in an oxidizing atmosphereor environment leads to an internal oxidation of the micro-cavities.

In accordance with another embodiment of the invention, thehigh-temperature treatment may be effected in such a way that thesubstrate is heated to a temperature of between 1000° C. and 1350° C.The heating may be effected for example for a duration of between 30 minand 2 h.

Another embodiment of the invention provides for the introduction ofoxygen into the micro-cavities to be effected by thermal indiffusion.

Yet another embodiment provides for the introduction of oxygen to beeffected by the implantation of oxygen, to put it another way by oxygenimplantation.

In accordance with one embodiment of the invention, silicon dioxideprecipitates may be formed by means of oxidation of the micro-cavities.Said silicon dioxide precipitates form a non-continuous (discontinuous)layer below the channel region of the transistor. Since the volume ofthe silicon dioxide (SiO₂) that arises is approximately 2.25 times aslarge as the volume of the original silicon, large tensile stress fieldsare produced by the SiO₂ precipitates in and/or near the channel region,as a result of which the electron mobility may be increased in n-MOSelements.

Another embodiment of the invention makes it possible, by means ofincreasing the density and/or the size of the silicon precipitates, toincrease the stress fields produced by the silicon precipitates in acontrolled manner. In other words, by varying the density and/or size ofthe silicon precipitates, it is possible to set a desired value of thetensile stress e.g. in the channel region. In this case, it is possible,in the context of a learning process or a learning cycle, to optimizethe values for the density and the size of the precipitates in order toobtain the desired tensile stress fields in the channel region withoutthe formation of e.g. lattice defects such as dislocations in thesubstrate.

Another embodiment of the invention provides for a nitride liner to beformed on a partial region of the first source/drain region and/or on apartial region of the second source/drain region and/or on a partialregion of the gate region. Additional tensile stress can be produced inthe channel region with the aid of the nitride liner.

Exemplary embodiments of the invention provide a simple method forproducing tensile stress which can be employed e.g. advantageously inthe fabrication of n-MOS field effect transistors. The method can forexample be integrated easily into a CMOS process flow and can be used toincrease the performance of n-MOS field effect transistors.

It should be noted in this connection that the formation of themicro-cavities and the oxidation of the micro-cavities for forming theband of SiO₂ precipitates must be effected at the beginning of the CMOSprocess, more precisely after the formation of a shallow trenchisolation (STI), but before the formation of a well region in thesubstrate by well implantation. This is due to the high temperaturebudget required for the oxidation of the micro-cavities.

In accordance with one embodiment of the invention, the size and thedensity of the micro-cavities can be controlled by means of the methodsteps described above. The size of the micro-cavities can scale with thetransistor dimensions and be correspondingly optimized for predeterminedtransistor dimensions.

One advantage of a method in accordance with one exemplary embodiment ofthe invention over selective SIMOX methods may be seen in the fact thatthe method is simpler and more cost-effective than selective SIMOX sincelower implantation doses and lower thermal budgets are required.

Another advantage of exemplary embodiments of the invention over SIMOXmay be seen in the fact that the precipitate band formed by oxidation ofthe micro-cavities is thin enough, to put it another way is occupiedonly sparsely with precipitates, such that an electrical insulation ofthe channel from the bulk is avoided. In other words, sufficiently manyand sufficiently large electrically conductive regions remain betweenthe individual SiO₂ precipitates of the band, so that free chargecarriers can be transported between the individual micro-cavities.

At the same time, however, the stress contributions of the individualcavities are superposed to form an average stress field in the channel.

In a method for fabricating a field effect transistor in accordance withanother embodiment of the invention, a first source/drain region and asecond source/drain region are formed in a substrate. Furthermore, achannel region is formed between the first source/drain region and thesecond source/drain region. Furthermore, a gate region is formed on thechannel region. Furthermore, micro-cavities are formed in the substrateat least below the channel region by means of the implantation of lightions into the substrate. Furthermore, the micro-cavities are oxidized.

In a method for fabricating a field effect transistor in accordance withanother embodiment of the invention, a first source/drain region and asecond source/drain region are formed in a substrate. Furthermore, achannel region is formed between the first source/drain region and thesecond source/drain region. Furthermore, a gate region is formed on thechannel region. Furthermore, micro-cavities are formed in the substrateat least below the channel region. The micro-cavities are oxidized,silicon dioxide precipitates being formed by means of the oxidation ofthe micro-cavities, so that a tensile stress field is produced at leastin a partial region of the channel region.

Exemplary embodiments of the invention can provide for example a simpleand cost-effective method for producing tensile stress in a channelregion of a field effect transistor, and also a field effect transistorwhich at least partly circumvent or avoid problems known fromconventional methods and field effect transistors.

FIG. 2A shows one process step of a method for fabricating a fieldeffect transistor in accordance with a first exemplary embodiment of theinvention. The implantation of light ions, in this case H₂ ⁺ ions, intoa silicon substrate 201 is shown. The light ions are implanted, by wayof example, with an implantation dose Φ=10¹⁶ cm⁻² and an implantationenergy E=38 keV. By virtue of the implanted light ions, covalent siliconbonds in the substrate 201 are broken and micro-platelets 203 areformed, preferably in a narrow band 205 centered around theconcentration maximum, clearly the range (projected range) R_(p), of thelight ions. R_(p)and hence the depth of the band 205 of micro-platelets203 can be varied by varying the parameters dose Φ and energy E. Theparameters dose Φ and energy E can be chosen such that themicro-platelets are formed below the channel region 204 of thetransistor to be formed. As shown in FIG. 2A, the micro-platelets 203are elongated along a plane parallel to the surface 202 of thesubstrate. In the case of a (100) substrate, the platelets may beelongated e.g. along the (100) plane, the lengths of the individualmicro-platelets being distributed around a mean value, which isillustrated in FIG. 3.

FIG. 3 shows a frequency distribution 300 of the lengths ofmicro-platelets or platelet-like defects which were formed by theimplantation of H₂ ⁺ ions with an implantation dose Φ=1.3×10¹⁶ cm⁻² andan implantation energy E=120 keV. The frequency distribution 300 revealsa mean platelet length of approximately 6.5 nm and a standard deviationof the platelet length of approximately 2.3 nm.

FIG. 2B shows the process step of implanting the light ions (H₂ ⁺ ionsin the example shown) into the substrate 201 in accordance with a secondexemplary embodiment of the invention. It shows the use of a hard mask210 composed of an oxide layer 210 a and a nitride layer 210 b formed onthe oxide layer 210 a, which are patterned in such a way that thelateral extent (identified by the double arrow “x”) of the region inwhich the micro-platelets 203 are formed, and thus also the lateralextent of the stressed region, is restricted to the area of the channelregion 204. To put it another way, the hard mask preventsmicro-platelets from being formed below the source/drain regions of thefield effect transistor. The mask 210 may have a size similar to thelength of the transistor gate.

FIG. 2C shows a further process step of the method for fabricating afield effect transistor in accordance with the exemplary embodiment ofthe invention. It shows a thermal treatment of the substrate 201 and ofthe micro-platelets 203 formed, to put it another way a heat treatmentstep or annealing step with a temperature T=700° C. and a time durationof t=60 min, i.e. with a low thermal budget, which is applied to thesubstrate 201 and the micro-platelets 203 formed. The heating results inan outdiffusion of the implanted H₂ ⁺ ions in the form of hydrogenmolecules (H₂ molecules), and a network or a band of micro-cavities 220′is formed from the micro-platelets 203. The temperature T and the timeduration t of the annealing step shown in FIG. 2C are only by way ofexample and can be optimized to the effect that the density and the sizeof the micro-cavities 220′ formed do not exceed predetermined thresholdvalues, with the result that a delamination of the substrate is avoided.

FIG. 2D shows a micrograph appertaining to cross-sectional transmissionelectron microscopy (XTEM) 250, in which the micro-cavities 220′ formedafter the first thermal treatment can be discerned.

FIG. 2E shows a further process step of the method for fabricating afield effect transistor in accordance with the first exemplaryembodiment of the invention. It shows a second thermal treatment, duringwhich the substrate is heated to a temperature of T=1100° C. for aduration of t=1 s. The second thermal treatment initiates a conservativeripening process of the micro-cavities 220 formed in the substrate 201,in the course of which a small number of large micro-cavities 220 areformed from the large number of relatively small micro-cavities 220′.

FIG. 2F shows an XTEM micrograph 260 of the large micro-cavities 220formed after the second thermal treatment. The large micro-cavities 220have a size such that they enclose a volume in a first dimension ofbetween 5 nm and 100 nm, for example of between 10 nm and 100 nm, in asecond dimension of between 20 nm and 100 nm and in a third dimension ofbetween 10 nm and 200 nm, for example of between 50 nm and 100 nm. Thedensity of the large micro-cavities 220 may be approximately 10¹¹ cm⁻³.

FIG. 2G shows a further process step of the method for fabricating afield effect transistor in accordance with the first exemplaryembodiment of the invention. It shows the oxidation of themicro-cavities 220 by the introduction of oxygen into the micro-cavities220 and a simultaneous high-temperature treatment during which thesubstrate is heated to a temperature of T=1200° C. for the duration oft=1 h. The introduction of oxygen into substrate or into themicro-cavities 220 is effected by thermal indiffusion in this case.Another possibility for introducing oxygen into the micro-cavities 220consists in the implantation of oxygen. Silicon dioxide precipitates 221form as a result of the oxidation of the micro-cavities 220, whichsilicon dioxide precipitates (SiO₂ precipitates) 221 form anon-continuous layer below the channel region 204 of the transistor. Onaccount of the oxidizing environment, a thermal silicon dioxide layer230 forms at the substrate surface 202 with an Si/SiO₂ interface 231.

FIG. 2H shows an XTEM micrograph 270 of the SiO₂ precipitates formedafter the oxidation of the micro-cavities. The oxidized micro-cavitiesor SiO₂ precipitates 221 shown in FIG. 2H have a size of approximately30 nm.

On account of the volume of silicon dioxide that is approximately 2.25times as large as that of silicon, the SiO₂ precipitates produce a hightensile stress field in or at least in the vicinity of the channelregion 204. In this case, the strength of the stress field dependsessentially on the size and the density of the SiO₂ precipitates.

The size and the density of the silicon dioxide precipitates 221 formeddepend in turn on the values of the process parameters (implantationdose, implantation energy, annealing temperatures, annealing timedurations), used during the individual method steps (light ionimplantation, tempering, oxidation).

FIG. 4A and FIG. 4B show XTEM micrographs 400 and 450, respectively, ofoxidized micro-cavities or SiO₂ precipitates which were obtained byusing different light ion implantation doses and implantation energies.During the formation of the SiO₂ precipitates shown in the XTEMmicrograph 400 (FIG. 4A), the light ion implantation was effected with arelatively low implantation dose of 2.0×10¹⁶ H₂ ⁺ cm⁻² and a relativelyhigh implantation energy of 120 keV, whereas during the formation of theSiO₂ precipitates shown in the XTEM micrograph 450 (FIG. 4B), arelatively high implantation dose of 1.2×10¹⁷ H₂ ⁺ cm⁻² and a relativelylow implantation energy of 38 keV were used during the light ionimplantation. In both cases, the light ion implantation was followed bya first thermal treatment at 700° C. for a duration of 1 h, a secondthermal treatment at 1100° C. for a duration of 1 s, and also anoxidation step at 1200° C. for a duration of 1 h.

It can be discerned from FIG. 4A and FIG. 4B that, in the case of thelow implantation dose in association with the high implantation energy,a relatively low density of silicon dioxide precipitates results (FIG.4A, “low density”), whereas a relatively high density of silicon dioxideprecipitates arises for the opposite case (FIG. 4B, “high density”). Thesilicon dioxide precipitates shown in the XTEM micrograph 450 (FIG. 4B)therefore produce a higher stress field than those shown in the XTEMmicrograph 400 (FIG. 4A). However, it can also be discerned from FIG. 4Bthat lattice defects in the form of dislocations formed with theparameters chosen, which is generally undesirable in the fabrication ofsemiconductor components.

By means of a learning process, however, it is possible to optimize theprocess parameters to the effect that optimum stress effects areobtained whilst simultaneously avoiding lattice defects such as e.g.dislocations.

FIG. 5 shows a field effect transistor 500 in accordance with oneexemplary embodiment of the invention comprising a substrate 501 (e.g.made of silicon), in which substrate 501 a first source/drain region502, a second source/drain region 503 and also a channel region 504 areformed. A gate insulating layer (gate dielectric) 505 a (e.g. made ofsilicon dioxide) is formed on the channel region 504, and a conductivegate layer (gate electrode) 505 b (e.g. made of polysilicon), is formedon the gate insulating layer 505 b. The gate insulating layer 505 a andthe conductive gate layer 505 b are part of the transistor gate, whichis encapsulated by electrically insulating spacers 506. A nitride liner507 is additionally formed on partial regions of the spacers 506, of thefirst source/drain region 502, of the second source/drain region 503 andof the conductive gate layer 505 b. The field effect transistor isformed as an n-MOS field effect transistor, comprising n-doped firstsource/drain region 502, n-doped second source/drain region 503 andp-doped channel region 504. Dopants used may be, by way of example,boron for the p-type doping of the channel 504, and arsenic orphosphorus for the n-type doping of the first source/drain region 502and the second source/drain region 503. In contrast to the field effecttransistor 100 shown in FIG. 1, in the case of the field effecttransistor 500 an individual continuous oxide layer is not formed belowthe channel 504, rather a multiplicity of discontinuous, i.e.non-continuous, oxidized micro-cavities 521 are formed, which oxidizedmicro-cavities 521 may be formed by a method for fabricating a fieldeffect transistor in accordance with one exemplary embodiment of theinvention.

It can be discerned from the illustration in FIG. 5 that the oxidizedmicro-cavities 521 produce a tensile stress field or tensile stress in aregion which contains at least one partial region of the channel region504 of the field effect transistor 500. To put it another way, theoxidized micro-cavities 521 formed below the channel region 504 producea tensile stress field extending at least into a partial region of thechannel region 504. The tensile stress produced in the channel region504 or in the partial region of the channel region 504 increases themobility of the charge carriers (electrons) in the channel 504 and hencethe functionality of the n-MOS field effect transistor. The liner layer507 likewise produces tensile stress in the channel region.

FIG. 6 shows the field effect transistor 500 from FIG. 5, the spacecharge regions proceeding from the first source/drain region 502 and thesecond source/drain region 503 being identified by the arrows designatedby “space charge”. Furthermore, the double arrows designated by “freecarrier transport” illustrate that charge carrier transport is possiblebetween the channel region 504 and the bulk of the substrate 501 throughthe conductive interspaces between the non-continuous micro-cavities521. In other words, the channel region 504 is not electricallyinsulated from the bulk, as is the case with the conventional fieldeffect transistor 100 shown in FIG. 1. Therefore, undesirable floatingbody effects and/or charging effects do not occur in the case of thefield effect transistor 500.

Although embodiments of the present invention and their advantages havebeen described in detail, it should be noted that diverse changes,replacements and innovations can be made to them without departing fromthe essence and scope of the invention as defined by the claimshereinafter. By way of example, it is readily evident to a personskilled in the art that many of the features, functions, processes andmaterials which are described herein can be altered in such a way thatthe alterations made still lie within the scope of the presentinvention. Furthermore, the intention is not to restrict the scope ofthe present invention to the specific embodiments of the process, of themachine, of the fabrication, of the material composition, of the means,of the methods or steps which are mentioned in the description. As theaverage person skilled in the art can readily gather from the disclosureof the present invention, it is also possible according to the presentinvention to utilize processes, machines, fabrication methods, materialcompositions, means, methods or steps which currently exist or will bedeveloped in the future, and which fulfill essentially the same task orachieve essentially the same result as the corresponding embodimentsthat have been described here. Accordingly, the intention is for theclaims hereinafter to include such processes, machines, fabricationmethods, material compositions, means, methods or steps within theirscope.

1-29. (canceled)
 30. A method for fabricating a field effect transistor,comprising: forming a first source/drain region and a secondsource/drain region in a substrate; forming a channel region between thefirst source/drain region and the second source/drain region; forming agate region on the channel region; forming micro-cavities in thesubstrate at least below the channel region; and oxidizing themicro-cavities.
 31. The method as claimed in claim 30, wherein the stepof forming the micro-cavities comprises: forming micro-platelets in thesubstrate, and forming the micro-cavities from the micro-platelets. 32.The method as claimed in claim 31, wherein the micro-platelets areelongated along a plane parallel to the surface of the substrate. 33.The method as claimed in claim 30, wherein the step of forming themicro-cavities comprises implanting light ions into the substrate. 34.The method as claimed in claim 31, wherein the step of forming themicro-cavities comprises implanting light ions into the substrate sothat the micro-platelets are formed in the substrate.
 35. The method asclaimed in claim 33, wherein the light ions are at least one of thetypes of light ions selected from the group consisting of H₂ ⁺ ions, He⁺ions, F⁺ ions, Ne⁺ ions, Cl⁺ ions, and Ar⁺ ions.
 36. The method asclaimed in claim 33, wherein the light ions are implanted with animplantation dose of between 10¹⁵ cm⁻² and 4×10¹⁷ cm⁻².
 37. The methodas claimed in claim 33, wherein the light ions used during theimplantation have an energy of between 10 keV and 150 keV.
 38. Themethod as claimed in claim 33, wherein the light ions are implantedusing a mask.
 39. The method as claimed in claim 31, wherein the step offorming the micro-cavities comprises thermally treating the substratewith the micro-platelets to form the micro-cavities.
 40. The method asclaimed in claim 39, wherein the step of thermally treating thesubstrate with the micro-platelets comprises heating the substrate to atemperature of between 600° C. and 800° C.
 41. The method as claimed inclaim 39, wherein the step of thermally treating the substrate with themicro-platelets comprises heating the substrate for a duration ofbetween 10 minutes and 2 hours.
 42. The method as claimed in claim 39,wherein the step of forming the micro-cavities further comprisesthermally treating the substrate a second time to effect a ripeningprocess of the micro-cavities.
 43. The method as claimed in claim 42,wherein the step of thermally treating the substrate a second timecomprises heating the substrate to a temperature between 1000° C. and1300° C.
 44. The method as claimed in claim 43, wherein the step ofthermally treating the substrate a second time comprises heating thesubstrate for a duration of between 1 μs and 1 s.
 45. The method asclaimed in claim 30, wherein the step of oxidizing the micro-cavitiescomprises: oxidizing the micro-cavities via a high-temperaturetreatment; and introducing oxygen into the micro-cavities.
 46. Themethod as claimed in claim 45, wherein the step of oxidizing themicro-cavities via a high-temperature treatment comprises heating thesubstrate to a temperature of between 1000° C. and 1350° C.
 47. Themethod as claimed in claim 46, wherein the step of oxidizing themicro-cavities via a high-temperature treatment comprises heating thesubstrate for a duration of between 30 minutes and 2 hours.
 48. Themethod as claimed in claim 45, wherein the step of introducing oxygeninto the micro-cavities comprises introducing oxygen into themicro-cavities by thermal indiffusing oxygen or by implanting oxygen.49. The method as claimed in claim 30, wherein a silicon substrate isused as the substrate.
 50. The method as claimed in claim 49, wherein a(100) silicon substrate or a (111) silicon substrate is used as thesubstrate.
 51. The method as claimed in claim 49, wherein the step ofoxidizing the micro-cavities results in a formation of silicon dioxideprecipitates, which produce a tensile stress field.
 52. The method asclaimed in claim 30, wherein the field effect transistor is an n-MOSfield effect transistor with an n-doped first source/drain region, ann-doped second source/drain region, and a p-doped channel region. 53.The method as claimed in claim 52, further comprising forming a nitrideliner on at least one region selected from the group of regionsconsisting of a partial region of the first source/drain region, apartial region of the second source/drain region, and a partial regionof the gate region.
 54. A method for fabricating a field effecttransistor, comprising: forming a first and a second source/drain regionin a substrate; forming a channel region between the first and thesecond source/drain region; forming a gate region on the channel region;forming micro-cavities in the substrate at least below the channelregion by implanting light ions into the substrate; and oxidizing themicro-cavities.
 55. A method for fabricating a field effect transistor,comprising: forming a first and a second source/drain region in asubstrate; forming a channel region between the first and the secondsource/drain region; forming a gate region on the channel region;forming micro-cavities in the substrate at least below the channelregion; and oxidizing the micro-cavities to form silicon dioxideprecipitates, wherein a tensile stress field is produced at least in apartial region of the channel region.
 56. A field effect transistor,comprising: a substrate; a first source/drain region formed in thesubstrate and a second source/drain region formed in the substrate; achannel region formed between the first source/drain region and thesecond source/drain region; and a plurality of oxidized micro-cavitiesformed in the substrate at least below the channel region.
 57. The fieldeffect transistor as claimed in claim 56, wherein the field effecttransistor is an n-MOS field effect transistor with an n-doped firstsource/drain region, an n-doped second source/drain region, and ap-doped channel region.
 58. The field effect transistor as claimed inclaim 56, wherein the substrate is a silicon substrate; and wherein theoxidized micro-cavities are silicon dioxide precipitates.
 59. The fieldeffect transistor as claimed in claim 56, wherein a nitride liner isformed on at least one region selected from the group of regionsconsisting of the gate region, the first source/drain region, and thesecond source/drain region.
 60. A field effect transistor fabricatedusing the method of claim 30.